Henkel Structural Bonding Solutions Glue Gun User Manual


 
11
Loctite
®
Hysol
®
9461 A&B
• Non-sag paste
• Heat accelerated
(4 min. @ 120°C)
• High peel strength
• Excellent low temperature
properties
Loctite
®
Hysol
®
9461 A&B is a
toughened, 2K-Epoxy adhesive,
suitable for applications requiring
gap filling and high peel strength.
Ideal for bonding dissimilar
substrates like GRP, SMC and
composites.
Loctite
®
Hysol
®
9464 A&B
• Non-sag paste
• Heat accelerated
(4 min. @ 120°C)
• Fast handling strength
• Excellent low temperature
properties
Loctite
®
Hysol
®
9464 A&B is a
toughened, 2K-Epoxy adhesive,
suitable for applications requiring
fast cure and high peel strength.
Ideal for bonding dissimilar
substrates like GRP, SMC and
composites.
Loctite
®
Hysol
®
9514
• Suitable for induction curing
• High shear and peel strength
• Excellent chemical resistance
• High temperature resistant
(200°C)
Loctite
®
Hysol
®
9514 is a
toughened, 1K-Epoxy adhesive,
suitable for gap filling and
resistance to high operating
temperatures. Ideal for applications
requiring toughness such as filter
and magnet bonding.
Medium working life
Heat curing
Gap filling
Gap filling
Fast cure
High temperature
resistant
9514
9464 A&B9461 A&B
2K-Epoxy 2K-Epoxy 1K-Epoxy
1:1 1:1 Heat cure
100:100 100:100 Heat cure
40min. 20min. 5min.
240min. 180min. 30min.
Grey Grey Grey
270Pa.s 270Pa.s 1,480Pa.s
24N/mm
2
22N/mm
2
46N/mm
2
10.0N/mm 10.5N/mm 9.5N/mm
-55°C to 120°C -55°C to 120°C -55°C to 200°C
50ml dual cartridge 50ml dual cartridge 300ml cartridge
400ml dual cartridge 400ml dual cartridge 20kg pail
1kg tubs 1kg tubs
20kg pails 20kg pails