Section 3 - Specifications Installing In-Sight™ 4000 Series Vision Sensors
28
3.1 General Specifications
Table 3-1: In-Sight 4000/4001 General Specifications
SPECIFICATION 4000 4001
Firmware
In-Sight version 2.30 and later.
Job/Program
8MB non-volatile flash memory; Unlimited storage via remote network device.
Memory
Image/Processing
16MB SDRAM
1/3-inch CCD
(5.84 x 4.94 mm, 6 mm diagonal)
1/3-inch CCD
(5.80 x 4.92 mm, 6 mm diagonal)
640 x 480 pixel display
(307,200 sq. pixels, 7.4 x 7.4 µm
1024 x 768 pixel display
(786,432 sq. pixels, 4.65 x 4.65 µm)
Sensor
Electronic shutter speed: .025ms to
1000ms
Electronic shutter speed: .04ms to
1000ms
Rapid reset, progressive scan (supports partial scan), full-frame integration.
256 gray levels (8 bits/sec)
Gain controlled by software.
Acquisition
Up to 38 frames per second Up to 18 frames per second
Image
Lens Type
C-mount
I/O* Trigger
1 opto-isolated, acquisition trigger input.
Remote software commands via Ethernet and RS232.
None built-in.
Discrete Inputs
8 inputs available using optional I/O Expansion Module (P/N 800-5758-1).
Unlimited
inputs using optional Ethernet I/O Module (P/N CIO-ENET-IN4).
2 built-in, high-speed outputs
Discrete Outputs
8 additional outputs available using optional I/O Expansion Module
(P/N 800-5758-1). Unlimited outputs using optional Ethernet I/O Module
(P/N CIO-ENET-OUT4).
Status LEDs
2 configurable (1 green, 1 red)
Network
1 Ethernet port, 10/100 BaseT, TCP/IP protocol. Supports DHCP (factory default) or
static IP address. Manual reset switch disable DHCP and forces factory-assigned,
static IP address.
Communications
Serial
1 RS-232C port (1200 to 115,200 baud rates)
Power
24 ± 10% VDC, 200mA, 4.8W supply
Material
Painted aluminum housing
Mounting
One ¼-20 and two M6 threaded holes
Dimensions
118.60 mm (4.66 in) x 43.18 mm (1.70 in) x 46.7 mm (1.84 in)
Mechanical
Weight
275.0 g (9.7 oz)
Temperature
10 to 45°C (Operating), -10 to 65°C (Storage)
Environmental
Humidity
10 to 90%, non-condensing (Operating and Storage)
Certifications
CE, CUL
* See Section 3.2: Detailed I/O Specifications for more information.