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GE864 Hardware User Guide
1vv0300694 Rev.10 - 10/06/08
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 5 of 69
12.1.7 Solder paste................................................................................................................................... 63
12.1.8 GE864 Solder reflow...................................................................................................................... 64
12.2 Packing system ....................................................................................................................65
12.2.1 GE864 orientation on the tray........................................................................................................ 66
12.2.2 Moisture sensibility ........................................................................................................................ 66
13 Conformity Assessment Issues....................................................................................67
14 SAFETY RECOMMANDATIONS.....................................................................................68
15 Document Change Log..................................................................................................69