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GE864 Hardware User Guide
1vv0300694 Rev.10 - 10/06/08
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 64 of 69
12.1.8 GE864 Solder reflow
The following is the recommended solder reflow profile
Profile Feature Pb-Free Assembly
Average ramp-up rate (T
L
to T
P
) 3°C/second max
Preheat
8 Temperature Min (Tsmin)
8 Temperature Max
(Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up Rate
3°C/second max
Time maintained above:
8 Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak Temperature (Tp) 245 +0/-5°C
Time within 5°C of actual Peak
Temperature (tp)
10-30 seconds
Ramp-down Rate 6°C/second max.
Time 25°C to Peak Temperature 8 minutes max.
NOTE: All temperatures refer to topside of the package, measured on the package body surface.
N
N
O
O
T
T
E
E
:
:
G
G
E
E
8
8
6
6
4
4
m
m
o
o
d
d
u
u
l
l
e
e
c
c
a
a
n
n
a
a
c
c
c
c
e
e
p
p
t
t
o
o
n
n
l
l
y
y
o
o
n
n
e
e
r
r
e
e
f
f
l
l
o
o
w
w
p
p
r
r
o
o
c
c
e
e
s
s
s
s