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GE864 Hardware User Guide
1vv0300694 Rev.10 - 10/06/08
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 61 of 69
12.1.4 Debug of the GE864 in production
To test and debug the mounting of the GE864, we strongly recommend to foreseen test pads on the
host PCB, in order to check the connection between the GE864 itself and the application and to test
the performance of the module connecting it with an external computer. Depending by the customer
application, these pads include, but are not limited to the following signals:
• TXD
• RXD
• ON/OFF
• RESET
• GND
• VBATT
• TX_TRACE
• RX_TRACE
• PWRMON
12.1.5 Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a
thickness of stencil foil ≥ 120µm.