Telit Wireless Solutions GE864 Work Light User Manual


 
GE864 Hardware User Guide
1vv0300694 Rev.10 - 10/06/08
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 62 of 69
12.1.6 PCB pad design
Non solder mask defined” (NSMD) type is recommended for the solder pads on the PCB.
Recommendations for PCB pad dimensions
Ball pitch [mm]
2,5
Solder resist opening diameter A [mm]
1,150
Metal pad diameter B [mm]
1 ± 0.05
Placement of microvias not covered by solder resist is not recommended inside the “Solder resist
opening”, unless the microvia carry the same signal of the pad itself.