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No. 99MBC032A
5.3.3 Measurement of the lead pitch of a multiple-pin IC
If the edge specification is made, it is possible to measure a dimension between two optional
edges from between 1 and 255 edges. This can be applied to inspecting the IC lead bend and
measurement of the head gap of an HDD.
Below is an example where the IC lead bend of a 160-pin flat package IC must be checked
using the automatic workpiece detection function. Assume that the pin thickness and lead-to-
lead interval are identical according to the specification.
The following IC specifications are used: 40 leads are on one side, the lead-to-lead interval is
0.635 mm (1/40"), the pitch tolerance is 0.01 mm.
40PIN
1PIN
P1
Edge 2
Edge 1
Edge 8
Edge 8
P2
P39
2PIN
3PIN
39PIN
Laser scan direction
• Basic setup
1. Segment specification
Specify the edge specification method.
2. Automatic workpiece detection
Specify use of automatic workpiece detection.
• Function setup
1. Segment
a. Start segment = 2
b. Finish segment = 81
(Last lead number x 2 +1)
2. Number of scans for averaging = 32
3. GO/NG judgment
a. Lower limit = 0.625 mm
b. Upper limit = 0.645 mm
4. Setting automatic measurement
Specify the pitch measurement.
5. Automatic workpiece detection setup
Measurement time = 1
Invalidation period = 20 ms
Lower detection limit = 0.6 mm
Upper detection limit = 0.67 mm
